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  • Copper Applications

    J.T.Baker® brand CLk™ photoresist and residue removal products are engineered to demanding requirements of the integration of copper interconnects in current and advanced technology nodes. The J.T.Baker® CLk™ photoresist and residue removal product line is proven to remove resist and polymer ash resulting from current generation processes such as copper damascene patterning, dual damascene metal deposition, and oxygen plasma strip. It also offers excellent performance for devices in higher nodes using copper metal lines. 

    Selection-Guide-for-Copper-Low-k

    Click here to download a copy of "Selection Guide for Copper Low-k" (PDF)